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Tesoro 11" widescan µMax coil opened up, falsing problem:

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  • #16
    it's real problem you have not the hands. i see one same picture everyday like Groundhog Day movie playlist. hey! you there! do anything man! take epoxy resin remover, wash it out!
    silent, new day will begin again from f-ng wakening because that is Groundhog Day!

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    • #17
      I'll probably end up putting it back together.

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      • #18
        Hi Pinpointer.

        After thinking about it, i may have a suggestion that may help you in isolating the problematic area for you.

        Either your problem is as Kt315 suggests that the coil lead entering the coil or maybe the upper side ground wire similar to the loose wire shown on your pic is loose. Try this.......

        Take unit out side on soil/grass free of metallic objects. Get someone to help you to hold the detector as if there detecting that area. Get the person to hold the detector still, flat on the ground. Once you have the detector settings adjusted, GB etc, try this....

        Now squeeze, hold or apply pressure with a couple of fingers to the coil area you think maybe faulting. You might need to secure and tape the loose wire in the picture under the coil so it does not move. Then while applying pressure, tap the coil gently with a non metallic object. Keep rotating, holding and trying different positions on the coil with tapping off course.

        If squeezing and applying pressure to the top half of the coil eliminates the falsing when tapped, then visually observe the position. If it happens to be the opposite side of the cable entering the coil, then the problem area maybe the faraday shielding wire may have come loose from graphite material on the top coil housing.

        If falsing is still occurring then as Kt315 suggested.

        Note also: if the wire is broken though and some internal moisture has built up between wire and graphite material then the above method will be useless, due to a higher resistance, Worth a try though.

        Cheers Sido

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        • #19
          Thanks Sido, I'll try that, I've actually striped back some of the foam, the shielding wire is a bit sus in one area, just looks a bit messy but I'll try squeezing it in that area.

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          • #20
            sido, best suggestion is to sell the coil as-is at ebay and forget about. the case is deadly burnt because there is not any progress movement.

            http://www.ebay.com/itm/INSAT-BGA-EP...item4d01789e95

            Insat BGA Epoxy Glue Remover
            100mL

            HP Laptop underfill glue problems?

            Not a problem with our Epoxy Glue Remover.

            Amazing ability to dissolve the rock hard underfill epoxy glue.

            Essential to remove underfill glue when reflowing laptop GPU.

            Now you can with total ease.
            The image above was captured about 10 minutes after applying the Insat BGA Epoxy Glue Remover. It can be seen clearly,
            the resin glue has dissolved and can be easily removed entirely by using a suitably thin dentist's pick.
            Anyone who has worked on a HP laptop would know how difficult removing the BGA IC can be with the epoxy glue intact.
            Removing the epoxy glue with our remover is now child's play. Our epoxy resin remover works like magic in less than 15
            minutes to allow the user to remove the epoxy resin glue easily and without fuss.
            Use in a well ventilated area and avoid contact with skin. Apply with brush and wait for 15 minutes before scraping away the
            epoxy glue. It is recommended to wash off the Insat Epoxy Glue Remover with warm water.

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            • #21
              Hi kt315, yes i would say also that the coil is un-repairable due to epoxy glue and the difficult nature of removing the coil from housing and without damaging further the coil winding lacquer protecting coating on copper wire with such epoxy remover as listed above.

              Interesting epoxy remover though kt315. I worked repairing BGA components for ten years with Nokia mobile phones. Thankfully no clear epoxy glue was needed to be removed on such delicate components. Though they did have a similar soft black epoxy looking putty on some earlier BGA components in 2000, but the process was scrapped for easier removal and repair.

              Never seen this product, but looks interesting.

              Below on pic is just a few observations of mine.

              Cheers Sido
              Attached Files

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