OP-Amps in a can...?

[GT Blocker]

Hey all,

I have a couple of questions.

I currently use a DIP version of the TI LM4562 ( http://www.ti.com/product/lm4562&lpo...native_Devices ) in my machine.

The .pdf above shows the metal can TO-99 form factor as a completely different design choice vs. DIP or SOIC. Why?

What, if any, advantage would this packaging present?

Is a metal 'canned' amp shielded from noise better, or...what?

Just wondered,
GTB

[Pennypacker]

Generally speaking, yes.

[Davor]

Canned devices tend to pass harsh environment specs with flying colours (e.g. radiation), and often are capable of handling more power, but that's about it. You could even attach a heatsink to them, but in most cases it is useless for you.

[ODM]

In most cases the surrounding circuitry has to be shielded from noise as well, such as feedback paths and input impedances, so only canned circuit module devices enjoyed a noise advantage.

At some point in history canned and ceramic packaged devices offered better aging properties, but I think it's not as much of an issue with modern devices for our purposes.