I accidentally got a hot air soldering iron today.
An old friend, a longtime TV service technician, has had one for several years.
According to him; he used mostly a part with an ordinary soldering iron and a part with hot air very rarely.
So I finally got that kind of tool.
I had the opportunity to get it back in 2001, but I always put it off and I didn't have a very positive attitude towards such a soldering tool.
However, at that time I did not even need such a tool.
But as time goes on; thus, the need and necessity to have such a tool in the workshop is increasingly indicated.
The problem is that I have known about such a tool for 20 years and I often have the opportunity to see how others work with it, while I have no personal experience.
And now that I have that tool; it would be very useful for me to hear from more experienced colleagues a few details about working with such a tool.
Initially, I looked on the Internet for what can be found.
Unfortunately the internet is overloaded with similar content and it would take me a few days of a detailed search to find answers to my questions.
Well, it's easier for me to ask here, maybe one of my colleagues will answer directly and clearly without too much theorizing.
I have a couple of simple questions about adjusting the temperature and airflow.
Keep in mind that I will use this mostly for amateur purposes, for amateur works.
I don't believe that I will ever be in a position to work with the smallest components, as well as with chips that have a large number of pins that are
very densely distributed.
So, I will mostly use 1206 size components and maybe sometimes 805. As far a chips I will mostly use simpler chips, dual in line.
This soldering tool will be equally useful for removing components as well as installing new ones.
So I am interested in the typical temperatures for such works as well as the typical air flow.
To avoid damage and burns to both the board and the components.
On some practical example, you could tell me the details.
As well as the pitfalls, disadvantages and advantages of this kind of work.
For example ... if I want to unsolder a 14-pin operational amplifier from a board; which would be the "safe" temperature and which would be the "safe" air flow.
And yet set up enough to get the job done easily and efficiently.
And also, if I want to solder a similar chip to a new printed circuit board; what would be the most suitable temperature and air flow?
Any specific advice is welcome.
Thanks in advance!
An old friend, a longtime TV service technician, has had one for several years.
According to him; he used mostly a part with an ordinary soldering iron and a part with hot air very rarely.
So I finally got that kind of tool.
I had the opportunity to get it back in 2001, but I always put it off and I didn't have a very positive attitude towards such a soldering tool.
However, at that time I did not even need such a tool.
But as time goes on; thus, the need and necessity to have such a tool in the workshop is increasingly indicated.
The problem is that I have known about such a tool for 20 years and I often have the opportunity to see how others work with it, while I have no personal experience.
And now that I have that tool; it would be very useful for me to hear from more experienced colleagues a few details about working with such a tool.
Initially, I looked on the Internet for what can be found.
Unfortunately the internet is overloaded with similar content and it would take me a few days of a detailed search to find answers to my questions.
Well, it's easier for me to ask here, maybe one of my colleagues will answer directly and clearly without too much theorizing.
I have a couple of simple questions about adjusting the temperature and airflow.
Keep in mind that I will use this mostly for amateur purposes, for amateur works.
I don't believe that I will ever be in a position to work with the smallest components, as well as with chips that have a large number of pins that are
very densely distributed.
So, I will mostly use 1206 size components and maybe sometimes 805. As far a chips I will mostly use simpler chips, dual in line.
This soldering tool will be equally useful for removing components as well as installing new ones.
So I am interested in the typical temperatures for such works as well as the typical air flow.
To avoid damage and burns to both the board and the components.
On some practical example, you could tell me the details.
As well as the pitfalls, disadvantages and advantages of this kind of work.
For example ... if I want to unsolder a 14-pin operational amplifier from a board; which would be the "safe" temperature and which would be the "safe" air flow.
And yet set up enough to get the job done easily and efficiently.
And also, if I want to solder a similar chip to a new printed circuit board; what would be the most suitable temperature and air flow?
Any specific advice is welcome.
Thanks in advance!
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